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Project:PCB Making: Difference between revisions
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# Photoresist Copper-clad board [http://www.maplin.co.uk/Module.aspx?ModuleNo=2033 Maplin product page (code FA61R)]. | # Photoresist Copper-clad board [http://www.maplin.co.uk/Module.aspx?ModuleNo=2033 Maplin product page (code FA61R)]. | ||
# Sodium | # Universal PCB Developer (Sodium Metasilicate Pentahydrate) [http://www.maplin.co.uk/Module.aspx?ModuleNo=2085 Maplin product page (code AP01B)]. - full bottle purchased 05-Aug-2010 | ||
# Ferric chloride [http://www.maplin.co.uk/Module.aspx?ModuleNo=2097 Maplin product page (code XX12N)]. | # Ferric chloride [http://www.maplin.co.uk/Module.aspx?ModuleNo=2097 Maplin product page (code XX12N)]. | ||
# Methylated spirits [http://www.wickes.co.uk/Methylated-Spirits/invt/600343 Wickes product page (code 600343)]. | # Methylated spirits [http://www.wickes.co.uk/Methylated-Spirits/invt/600343 Wickes product page (code 600343)]. | ||
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[[File:UV_Exposure.jpg|400px]] | [[File:UV_Exposure.jpg|400px]] | ||
<br> | <br> | ||
2. The photo sensitive coating weakens as a result of exposure, and is rinsed off with a 10% sodium | 2. The photo sensitive coating weakens as a result of exposure, and is rinsed off with a 10% sodium of "Universal PCB Developer". (1-2 minutes) | ||
<br> | <br> | ||
[[File:RemovalExposedPhotoSensitiveArea.jpg|400px]] | [[File:RemovalExposedPhotoSensitiveArea.jpg|400px]] | ||
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The chemicals can be returned to their respective bottles, and the small residue in the tubs used in the process should be rinsed out in the sink. | The chemicals can be returned to their respective bottles, and the small residue in the tubs used in the process should be rinsed out in the sink. | ||
Once spent, the | Once spent, the Universal PCB Developer solution can be poured down the drain. The ferric chloride on the other hand, must be taken to a Harzadous Disposal Unit, or, deactivated according to this [[Projects/Deactivating a ferric chloride solution|method]]. | ||
== Real life example == | == Real life example == | ||
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* Expose in the UV box. | * Expose in the UV box. | ||
* Developing the photoresist in a | * Developing the photoresist in a Universal PBC Developer solution. | ||
[[File:TQFP32_DIL32_PhotoresistDevelopment.jpg|400px]] | [[File:TQFP32_DIL32_PhotoresistDevelopment.jpg|400px]] | ||
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== Notes == | == Notes == | ||
=== Universal PCB Solution === | |||
According to the [http://www.chilternconnections.co.uk/ZENCART/HANDSSHEETS/Etching%20Products/PDSM_MSDS.pdf safety datasheet] of the PCB photoresist developer (Universal PCB Developer, manufactured by Chiltern Connections Ltd and sold by Maplin), the compound is Sodium Metasilicate Pentahydrate, containing the hazardous ingredient Disodium Metasilicate at a concentration of 58%. | |||
=== Artwork === | === Artwork === | ||
