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Equipment/PCB etch station: Difference between revisions
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Planning to change to use CuCl2 in the bubble etch tank. Do NOT mix this with Ferric Chloride. In fact, please don't use ferric chloride at all - it silts up the tank and is really difficult to clean up. If there is some reason why we wish to use it again, it may be possible to use the 4th tank for it. | Planning to change to use CuCl2 in the bubble etch tank. Do NOT mix this with Ferric Chloride. In fact, please don't use ferric chloride at all - it silts up the tank and is really difficult to clean up. If there is some reason why we wish to use it again, it may be possible to use the 4th tank for it. | ||
=== | ===Planned changes=== | ||
* It would be nice to have power without using the extension lead. The existing ring main might be extended fairly easily to put sockets on the wall near the sink | |||
*Use Cupric chloride in the etch tank rather than Ferric chloride, which is messier, requires frequent replacement and silts up the bubbler. | |||
*Replace the bubbler in the bottom of the tank with a bar suspended from the basket, so that it's easier to clean. | |||
*Link both the large air pump and the small one into the same air supply so the cupric chloride can easily be regenerated (requires long slow bubbling rather than short fast bubbling) | |||
*It would be nice to have power without using the extension lead. The existing ring main might be extended fairly easily to put sockets on the wall near the sink. | |||
==Model== | ==Model== | ||
