Project:PCB Making: Difference between revisions
From London Hackspace Wiki
→Steps in a nutshell
| Line 57: | Line 57: | ||
Note in this cross section, black in the transparency layer represents a via (trail) on the left and a pad (where a component pin will be soldered) on the right. | Note in this cross section, black in the transparency layer represents a via (trail) on the left and a pad (where a component pin will be soldered) on the right. | ||
<br><br> | <br><br> | ||
1. The artwork (printed onto | 1. The artwork (printed onto acetate or paper) is placed over the photoresist copper-clad board and exposed to UV light. (8 minutes) | ||
<br> | <br> | ||
[[File:UV_Exposure.jpg|400px]] | [[File:UV_Exposure.jpg|400px]] | ||
