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Project:PCB Making: Difference between revisions
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The method described consists of exposing, developing, etching, drilling and tinning a photoresist copper-clad board. | The method described consists of exposing, developing, etching, drilling and tinning a photoresist copper-clad board. | ||
== Other Methods and Guides == | |||
There are also [http://www.opencircuits.com/Chemical_Etchants alternatives] to some of the chemical processes - e.g. | |||
[[Cupric_chloride_etchant|Air-regenerated etchant]] | |||
Another guide can be found here : [http://www.electricstuff.co.uk/pcbs.html Mike's electric stuff] | |||
== Bill of Materials (BOM) == | == Bill of Materials (BOM) == | ||
