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Project:YAAC: Difference between revisions
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→First assembly
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# Drill with 0.8mm drill bits only - the one I used (probably 1mm or thicker) lifted the copper. | # Drill with 0.8mm drill bits only - the one I used (probably 1mm or thicker) lifted the copper. | ||
# Refer to BOM before laying out PCB. | # Refer to BOM before laying out PCB. | ||
# Best printed straight from eagle to media, via pdf caused design to shrink, rendering pin strip pads unusable. | # Best printed straight from eagle to media, via pdf caused design to shrink, rendering pin strip pads unusable ("Samthetetchie" pointed out this could have been the pdf auto-adjusting to fit page width, or something in those lines, so jury still out on the pdf route). | ||
== Third assembly == | |||
[[File:Yaac2020.v4.assembled.jpg|400px]] | |||
Yet another (improved) version, the same breakout with more SMD components. | |||
General notes: | |||
# Vias drilled with 0.5mm drill bit, soldered to a twisted three-strand wire. | |||
# Pin strip holes drilled in two hits, first 0.7mm, second 0.9mm. This was to avoid copper being lifted by 0.9mm drill bit. | |||
# Used solder paste for the first time (67/33 tin/lead mix - no signs of lead poisoning yet, note to self, revisit this page in 2031 to update). Dispensing was disastrous but once hot air was blown everything fell into place - nice bonus. | |||
# Electrolytic capacitor positive end has a light brown stripe (they are on the board's underside and not visible on photo). | |||
# Apply air gently - one capacitor almost went airborne. | |||
# Ready state easily identifiable as solder paste colour changes from dark grey to silver. | |||
== Software required == | == Software required == | ||
