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Equipment/Farnell TSV70: Difference between revisions

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*Soak test  
*Soak test  
*Replace output terminals (on order, expected thursday)
*Replace output terminals (replacements need trags redrilling - WIP)
*Make side panels (on order, expected monday)
*Place in usable location (maybe under the solder oven, on a stand, with nice long thick DC leads added).
*Place in usable location (maybe under the solder oven, on a stand, with nice long thick DC leads added).